Discover the top beauty packaging design trends for this year, as picked by Patrick Llewellyn, VP Digital and Design Services ...

The packaging design and simulation technology industry is evolving rapidly, driven by advancements in software tools that ...

High density and complex connectivity introduce new challenges for packaging design and assembly manufacturing validation.

AI is driving advancements in packaging efficiency with applications in areas like predictive demand forecasting, smart ...

"MZ Technologies was the first EDA company to deliver a commercially available co-design tool three years ago and now GENIO ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

GENIO EVO is the second generation of GENIO ™, which was the EDA's first successful integrated chiplet/package co-design tool. GENIO, MZ's flagship product, is a cross-fabric platform for system ...